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LED Lamp Encapsulation Technology
Apr 24, 2017

LED encapsulation technology innovation has always been an important weight to increase the value of products. On the one hand, CSP chip-level encapsulation, flip LED technology, to power supply module technology gradually mature and achieve large-scale production, by the industry's widespread concern, the next focus is to improve cost-effective; on the other hand, the market for EMC encapsulation, COB integrated encapsulation and high-voltage LED encapsulation continues to explode, and future growth spaces will focus on niche markets.

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